| abstract |
Provided is a method for forming a resist pattern, which can perform exposure of a solder resist material in a short time and can be exposed by a laser using the same solder resist material as in the prior art. An ultraviolet photosensitive solder resist film 7 whose surface is covered with a cover film 6 is formed on a printed wiring board 3, and ultraviolet light is blocked above the solder resist film 7 to form a visible light photosensitive resist film 8. Formed and exposed with a visible light laser 10, the resist pattern 8 is exposed to the resist film 8, developed with water to form a mask pattern with the resist pattern 11 with a cured film of the resist film 8, Using the mask pattern as a mask, the solder resist pattern 5 is exposed to the solder resist film 7 and developed with a weak alkaline developer, and the solder resist pattern 5 is formed on the printed wiring board 3 by a cured film of the solder resist film 7. [Selection] Figure 2 |