| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0e0176d825a579034bf5e95c68b680cf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_26708df5375e8f276954eed43b8b6faf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_66467fe5b0acf469afb972f300bcfb87
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_360210014eabc350cc8d31233152c0f1 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12681
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12674
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12903 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76861
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-617
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-14 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2010-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d2cd94b3d035ad9746fcc19c4c244f0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46a0c1d783496ce35111aa83162532e2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5cce5a1697fe90f3edcd27926fe4e490 |
| publicationDate |
2010-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2010092579-A1 |
| titleOfInvention |
A process for electroplating of copper |
| abstract |
A process for electroplating high adhesion copper layer on a surface of a highly oxidizable metal in an invariable container, and products produced by this process are provided. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2818578-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/SE-545031-C2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/SE-2150946-A1 |
| priorityDate |
2009-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |