| abstract |
Disclosed is an epoxy resin composition for use in the sealing of a semiconductor, which comprises an epoxy resin, a curing agent, at least one inorganic filler selected from a silicate (e.g., talc, fired clay, unfired clay, mica, glass), an oxide (e.g., titanium oxide, alumina, silica, fused silica) and a hydroxide (e.g., aluminum hydroxide, magnesium hydroxide, calcium hydroxide), and a pH-adjusting agent having a pH buffer zone of pH 4 to 8. Also disclosed is a semiconductor device comprising a semiconductor element sealed with a cured product of the epoxy resin composition. |