abstract |
An object of the present invention is to provide an epoxy resin composition for semiconductor encapsulation that provides a semiconductor device having excellent moisture resistance reliability and a semiconductor device using the same. An epoxy resin composition for semiconductor encapsulation of the present invention comprises an epoxy resin, a curing agent, semi-calcined hydrotalcite, and an inorganic filler different from the semi-calcined hydrotalcite. To do. The semiconductor device of the present invention is characterized in that a semiconductor element is sealed with a cured product of the above-described epoxy resin composition for sealing a semiconductor. [Selection figure] None |