| abstract |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound and is excellent in moldability, flame retardancy, high-temperature storage characteristics, moisture resistance reliability, and solder crack resistance. To provide. SOLUTION: (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, and (E) a hydrotalcite compound represented by the general formula (1). The average particle size obtained by baking at 00 to 900 ° C. is 0.5 １５15 μm, particle size 0.2 μm or less 10% by weight or less, particle size 20 μm or more 3% by weight or less, specific surface area 50 m 2 / g A compound represented by the following general formula (2), and (F) An epoxy resin composition for semiconductor encapsulation, comprising red phosphorus or a red phosphorus-based flame retardant as an essential component. Mg a Al b (OH) c (CO 3 ) d (1) Mg x Al y O z (2) (where a, b, c, d, x, y, and z are positive numbers of 0.1 or more. ) |