| abstract |
The invention provides a method to form a pattern of a functional material on a substrate for use in electronic devices and components. The method uses a stamp having a relief structure to transfer a mask material to a substrate and form a pattern of open area on the substrate. The functional material is applied to the substrate in at least the open area. The mask material is removed from the substrate, forming the pattern of functional material on the substrate. The method is suitable for the fabrication of microcircuitry for electronic devices and components. |