| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e75e3ac39ab15343a40b35be7c7bdab1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c77ee22395b242f076d736ae770b9899
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3d6be4705c0313dacfa905ead71ca132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_32c182780ae8fd1eabf081eb5ef98479 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31554
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31551
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2896 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1608
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1893 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 |
| filingDate |
2007-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_956cbc9f1cb268efa407568784122d6f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a63d30838eb8204e7bea7b82bcb6ea74 |
| publicationDate |
2007-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2007108351-A1 |
| titleOfInvention |
Material to be plated by electroless plating and method of electroless plating on the same |
| abstract |
A material to be plated by electroless plating which has satisfactory catalyst adhesion and in which the catalyst adhesion layer does not peel off the nonconductive base in a catalyst adhesion step, a development step, and other step(s). The material to be plated by electroless plating comprises a nonconductive base and a catalyst adhesion layer formed thereover, wherein the catalyst adhesion layer is made of a hydrophilic and/or water-soluble resin having hydroxy groups and a cured layer formed from a hydroxylated resin and an isocyanate compound is disposed between the base and the catalyst adhesion layer. Preferably, the catalyst adhesion layer is formed while the isocyanate group of the isocyanate compound remains in the cured layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016039282-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016039283-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018090654-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015034317-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013047386-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013049920-A |
| priorityDate |
2006-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |