| abstract |
Disclosed is a photosensitive film for forming permanent patterns of solder resist utilized as insulating films or protective films on printed wiring boards for example, that exhibits higher thermal resistance, higher surface hardness, and lower thermal expansion, and represents superior conformability to irregularities of substrate surface and less possibility of inferior adhesion of solder resist. The photosensitive film according to the present invention comprises a support, a cushion layer, and a photosensitive layer, in this order, wherein the photosensitive layer is formed of a photosensitive composition which comprises (A) a binder, (B) a polymerizable compound, (C) a photopolymerization initiator, and (D) a filler, and the photosensitive film is utilized for forming a permanent pattern. |