| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_03d0f52bb4069f8a19d70dcfb697c67a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0773
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0793
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0023 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate |
1996-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a187aa555fb12707f603e1fa9d5ce8a |
| publicationDate |
1997-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H09244239-A |
| titleOfInvention |
Method for manufacturing photosensitive element and multilayer wiring board |
| abstract |
(57) 【Abstract】 PROBLEM TO BE SOLVED: To form a photosensitive insulating resin layer by a laminating method and to improve adhesion with a metal plating film without causing safety and environmental problems. Provided are a conductive element and a method for manufacturing a multilayer wiring board using the same. An aqueous resin layer containing at least one kind of fine particles having an average particle diameter or an average aggregate diameter of 1 to 10 μm on a temporary support, and a photosensitive insulating resin layer provided on the aqueous resin layer. The photosensitive element to be, and this photosensitive element is provided on the insulating base material on which the wiring pattern is formed by heating, pressure bonding (laminating), and after exposure, A method for manufacturing a multilayer wiring board, comprising forming a via hole by development, performing post-exposure and post-baking, subsequently performing electroless plating and electrolytic plating, and then performing interlayer connection and forming a second layer wiring. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006004171-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007033685-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005093515-A1 |
| priorityDate |
1996-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |