| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2428d1fd54ddec8dbe860413937d0a05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8927f749c5efd2dd060013ebf5a709cb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0b195de217337ed36a43935d48ef8fb5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_286b704473020f89e2143622c89eea1c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8cf8d77ac0eff1767b22d2fb9445b64d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32623
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32477 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H1-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H1-00 |
| filingDate |
2003-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e945e4f46d6dce7196d9df5f23cf3ba3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_08e0e70d1335d9e62b7135884a2a6b41
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43ab9dfea50d4a6b9424d5975f1964a2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_69bccd2de10a1bd0fe76669e30a84f63 |
| publicationDate |
2003-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-03096765-A2 |
| titleOfInvention |
Apparatus and methods for minimizing arcing in a plasma processing chamber |
| abstract |
A plasma processing chamber for processing a substrate to form electronic components thereon is disclosed. The plasma processing chamber includes a plasma-facing component (602) having a plasma-facing surface oriented toward plasma in the plasma processing chamber during processing of the substrate, the plasma-facing component being electrically isolated from a ground terminal. The plasma processing chamber further includes a grounding arrangement (600) coupled to the plasma-facing component, the grounding arrangement including a first resistance circuit (610) disposed in a first current path between the plasma-facing component and the ground terminal. The grounding arrangement further includes a RF filter arrangement (604, 610) disposed in at least one other current path between the plasma-facing component and the ground terminal, wherein a resistance value of the first resistance circuit is selected to substantially eliminate arcing between the plasma and the plasma-facing component during the processing of the substrate. |
| priorityDate |
2002-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |