http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5904571-A

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filingDate 1996-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1999-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_720704e4f86e8faa89ccd1767db13ec2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d677933c452c28d5d4d7f1a86f409b3
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publicationDate 1999-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-5904571-A
titleOfInvention Methods and apparatus for reducing charging during plasma processing
abstract An apparatus and method in a plasma processing chamber for reducing charging of a wafer is described. A plasma generating element is configured to cause a plasma including ions and free radicals to be formed in a plasma generating region. A plasma diffusion region is configured so that plasma generated in the plasma generating region can diffuse through the plasma diffusion region. A conductive grid is positioned within the plasma diffusion region between the wafer and the plasma generating region. The conductive grid includes a mesh which is configured to trap a portion of the ions so that a portion of the ions are prevented from diffusing through the diffusion region to reach the wafer.
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priorityDate 1996-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 39.