http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8969460-B2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_adb0e564374fedf34b36103d36e6455a |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-005 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-0041 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 2014-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57a77457bf0d6c6e5d609f5037a26abf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42cbd80bc271e8a12a37df4ee04eb765 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0499aecdfb29e8fa5791e98c772dd9cf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b46e3e84ec1779a5a8ec563e36dd3ebc |
| publicationDate | 2015-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-8969460-B2 |
| titleOfInvention | Heat stabilized moulding composition |
| abstract | A thermostabilized thermoplastic molding composition includes a) a thermoplastic polyamide composition which consists of a blend of at least two polyamides. The at least two polyamides include a1) at least 50 mass %, relative to the total mass of the thermoplastic polyamide composition, of a first polyamide (PA-1) selected from the group consisting of polyamide-4,6, polyamide-6,6 and semi-aromatic polyamides and mixtures thereof; and a2) an amount of 1-50 mass %, relative to the total mass of the thermoplastic polyamide composition, of a second polyamide (PA-2) selected from the group consisting of polyamide-6 and copolymers thereof. The composition also contains b) 0.001-3 mass %, relative to the total mass of the thermoplastic polyamide composition, of a copper salt; and c) 0.01-10 mass %, relative to the total mass of the thermoplastic polyamide composition, of iron oxide. The molding composition exhibits reduced deterioration when exposed to an elevated temperature of 230° C. for a prolonged time period of 1000 hours as compared to an identical molding composition including a Cul/KI stabilization system but not including the iron oxide. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11608423-B2 |
| priorityDate | 2005-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 133.