| abstract |
The invention relates to a polyamide resin composition, comprising a mixture of 30 to 90 parts by weight of (a) a polyamide with a C/N ratio of between 4 and 7, (b) 10 to 70 parts by weight of a polyamide with C/N ratio of more than 7 and (c) 0.02 to 3 parts by weight based on 100 parts by weight of the mixture of a compound containing two or more carboxyl groups or an acid anhydride group. n The composition shows excellent moldability and resistance to metallic halide compounds. |