| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7ef01e33058cf740cf2197991be97af1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8fe7338a7e15cc1c684b1efcf21cd2a6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_931147cc47d22bdd8a4b4f5252e05de0 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-0853
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J123-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J123-0853
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J131-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J131-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J123-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J123-14 |
| filingDate |
2012-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3ea61ff59df3460b854b36d43b4658e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7c4a1e9f7789fb5d5f60b5883ad9cf2 |
| publicationDate |
2014-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8877856-B2 |
| titleOfInvention |
Adhesive resin composition and hot melt adhesive obtained therefrom |
| abstract |
Provided is an adhesive resin composition having improved heat resistance without deteriorations in adhesive strength and flexibility. The adhesive resin composition comprises 30 to 98 wt % of an ethylene/vinyl acetate copolymer (a) and 70 to 2 wt % of a propylene resin composition (P), wherein the total of the component (a) and the component (P) is 100 wt %. The propylene resin composition (P) comprises 60 to 0 wt % of a propylene polymer (b) having a melting point of 120 to 170° C. and a melt flow rate of 0.1 to 500 g/10 min, and 40 to 100 wt % of a propylene polymer (c) having a melting point of less than 120° C. or showing no melting points and having a melt flow rate of 0.1 to 500 g/10 min, wherein the total of the component (b) and the component (c) is 100 wt %. |
| priorityDate |
2011-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |