abstract |
(57) [Problem] To provide an ethylene-vinyl acetate copolymer-based hot melt adhesive having excellent heat resistance. SOLUTION: (A) Melt index (MI) 1 0 to 5000 g / 10 min, vinyl acetate content (VA) 5 to 50% by weight, Mw / Mn 2.0 to 4.0, content of low molecular weight component 24% by weight or less, and melting point (MP), MI and VA are as follows: MP ≧ 120−4.1 [log (MI)] − 1.33 VA (where MP is ° C., MI is g / 10 min, and VA is% by weight) Ethylene-vinyl acetate copolymer to be filled, (B) (a) atactic polypropylene, (b) Amorphous polyolefin, (c) fluoropolymer, (D) A hot melt adhesive composition containing a poly (oxyalkylene) polymer. |