| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b051f9f7933c758e66f6ceda5c9fb2cc |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate |
2013-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c81f5240dad312640fd65bad1898470b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57c13266335464715909409d3b941d74 |
| publicationDate |
2014-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8790521-B2 |
| titleOfInvention |
Combination, method, and composition for chemical mechanical planarization of a tungsten-containing substrate |
| abstract |
A combination, composition and associated method for chemical mechanical planarization of a tungsten-containing substrate are described herein which afford tunability of tungsten/dielectric selectivity and low selectivity for tungsten removal in relation to dielectric material. Removal rates for both tungsten and dielectric are high and stability of the slurry (e.g., with respect to pH drift over time) is high. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10428242-B2 |
| priorityDate |
2008-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |