| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0c20dac5f1a44475c96d2db944e79786
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c2b305abe1bcd94e29a96dc8401708c2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b713a10ad33e575f24225741cb4d6cc6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cd3e0d2288b156f698fab231a91aea59
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_82f0f363822925c1505d6194dc8474b3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_68e9185edc73dabe4943cbc36ed0f8ab |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83104
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83862
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15787
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3445
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4246
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0025 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2011-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_832c3903d0a38f7db55704e157a2c480
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5701e6b43f78e25e60eadc29f22ff413
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9756ab50ee83e172a3195f28925f1f63
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d5d887d12eee7e52e45f9f341f1f32b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03b63a716e31b4793e8b8d9e6d360b94 |
| publicationDate |
2013-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8470936-B2 |
| titleOfInvention |
Liquid epoxy resin composition for semiconductor encapsulation |
| abstract |
A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) at least one epoxy resin, (B) at least one curing accelerator and (C) at least one acid anhydride terminated polyamic acid. The liquid epoxy resin composition provides a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9627784-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9974179-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10750615-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10368441-B2 |
| priorityDate |
2011-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |