| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K77-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F222-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F22-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-00 |
| filingDate |
1992-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8595a5bc16d8e1f43aea127506fa3804
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_327237b87842030b0a3661b3b741fbb5 |
| publicationDate |
1994-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H06151652-A |
| titleOfInvention |
Semiconductor device |
| abstract |
(57) [Summary] [Structure] A semiconductor element is sealed with a resin composition containing the following components (A) to (E). (A) A polymaleimide compound having two or more maleimide groups in one molecule. (B) Allylated phenolic resin. (C) Curing catalyst. (D) At least one of an aliphatic carboxylic acid and a metal salt of an aliphatic carboxylic acid. (E) Inorganic filler. [Effect] Since the encapsulating plastic package is different from the conventional encapsulating material for maleimide resin composition, the mold releasing property between the encapsulating resin and the mold is excellent, and the package cracks even when the solder is dipped after absorbing moisture. It does not occur and has excellent heat resistance. Moreover, the humidity resistance is improved, and the reliability is further improved under severe usage conditions. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011178986-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7006344-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002037816-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001234033-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8470936-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013026660-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103717634-A |
| priorityDate |
1992-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |