| abstract |
A chip having a solder bump adheres to a substrate without decreasing wettability to a solder, and without using a step of cleaning a residual fluxing agent. Furthermore, adhesive strength is improved by lowering elastic modulus of the cured material. There is used an electrically connectable adhesive agent for a semiconductor, which comprises an epoxy resin, an acid anhydride curing agent, a curing accelerator and a butadiene-acrylonitrile rubber containing a carboxyl group. |