| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4215
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-186
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-688
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K85-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-844 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-52 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-0203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 |
| filingDate |
2008-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2011-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8facd65401511ccb12d277108325c787
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_422be13a636652da59dfaf19dc16ecfb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72fac3404fa6401850068afac75814b1 |
| publicationDate |
2011-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7919550-B2 |
| titleOfInvention |
Encapsulant of epoxy group-containing (meth)acrylic polymer, anhydride and (meth)acrylic monomer |
| abstract |
A photosemiconductor encapsulating resin composition, excellent in light transmittance, ultraviolet resistance and heat resistance, comprising the following component (A) and component (B):n (A): a (meth)acrylic polymer containing an epoxy group, and (B): at least one hardener selected from the group consisting of the following components (b 1 ) to (b 4 )n (b 1 ) a polyvalent carboxylic acid, (b 2 ) a polyvalent carboxylic anhydride, (b 3 ) a reaction product of a polyvalent carboxylic acid with a compound of the following general formula (B-1), and (b 4 ) a reaction product of a polyvalent carboxylic anhydride with a compound of the following general formula (B-2) n nn nwherein R 1 to R 6 represent each independently a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, R 3 and R 4 may be bonded to form an alkylene group having 1 to 8 carbon atoms; R 7 represents an alkylene group; a methylene group contained the alkylene group and the alkyl group represented by R 1 to R 7 may be substituted by an ether group and/or carbonyl group; Y 1 and Y 2 represent each independently an oxygen atom, or sulfur atom, is provided. |
| priorityDate |
2001-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |