abstract |
A photosemiconductor encapsulating resin composition, excellent in light transmittance, ultraviolet resistance and heat resistance, comprising the following component (A) and component (B):n (A): a (meth)acrylic polymer containing an epoxy group, and (B): at least one hardener selected from the group consisting of the following components (b 1 ) to (b 4 ):n (b 1 ) a polyvalent carboxylic acid, (b 2 ) a polyvalent carboxylic anhydride, (b 3 ) a reaction product of a polyvalent carboxylic acid with a compound of the following general formula (B-1), and (b 4 ) a reaction product of a polyvalent carboxylic anhydride with a compound of the following general formula (B-2) n nn nwherein R 1 to R 6 represent each independently a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, R 3 and R 4 may be bonded to form an alkylene group having 1 to 8 carbon atoms; R 7 represents an alkylene group; a methylene group contained the alkylene group and the alkyl group represented by R 1 to R 7 may be substituted by an ether group and/or carbonyl group; Y 1 and Y 2 represent each independently an oxygen atom, or sulfur atom, is provided. |