| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1eb9cd2af2f87dcf20b0fbbdfe79996e |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76837
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02164 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 |
| filingDate |
2005-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32ae034d970c5363a3db288a895535cd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8860fee8d8ab7e9a07e207abc0ef3c7c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d5e7eee6bd443a12399d057ae2cb9a2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ccac03fe3e92530a085eccd730f8b4dc |
| publicationDate |
2008-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7344996-B1 |
| titleOfInvention |
Helium-based etch process in deposition-etch-deposition gap fill |
| abstract |
Plasma etch processes incorporating helium-based etch chemistries can remove dielectric a semiconductor applications. In particular, high density plasma chemical vapor etch-enhanced (deposition-etch-deposition) gap fill processes incorporating etch chemistries which incorporate helium as the etchant that can effectively fill high aspect ratio gaps while reducing or eliminating dielectric contamination by etchant chemical species. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009215214-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7648872-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8030156-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8021992-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11574806-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8133797-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008138948-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009275163-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8395249-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9559051-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010081242-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008124940-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7648921-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10672605-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009286381-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8309413-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180116151-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007049034-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7727906-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7993950-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7989262-B2 |
| priorityDate |
2005-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |