| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d80f1040809503e54509c871ba828f75 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76856
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76874
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28556
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2005-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43a4dc0d31aa6016dc7428009c19f40c |
| publicationDate |
2007-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7288479-B2 |
| titleOfInvention |
Method for forming a barrier/seed layer for copper metallization |
| abstract |
A method for improving adhesion of Cu to a Ru layer in Cu metallization. The method includes providing a substrate in a process chamber of a deposition system, depositing a Ru layer on the substrate in a chemical vapor deposition process, and forming a Cu seed layer on the Ru layer to prevent oxidation of the Ru layer. The Cu seed layer is partially or completely oxidized prior to performing a Cu bulk plating process on the substrate. The oxidized portion of the Cu seed layer is substantially dissolved and removed from the substrate during interaction with a Cu plating solution, thereby forming a bulk Cu layer with good adhesion to the underlying Ru layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009130843-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010081274-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8247030-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009065939-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7884012-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7704879-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009087981-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010037074-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7776740-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009186481-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009226611-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7799681-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7829454-B2 |
| priorityDate |
2005-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |