| abstract |
A radiation-sensitive resin composition comprising (A) a resin comprising at least two recurring units of the formulas (1)–(6) in the total amount of 5–70 mol %, but each in the amount of 1–49 mol %, the resin being insoluble or scarcely soluble in alkali, but becoming easily soluble in alkali by the action of an acid, and (B) a photoacid generator. n nwherein R 1 is a hydrogen or methyl and R 2 is a substituted or unsubstituted alkyl group having 1–4 carbon atoms. The resin composition is useful as a chemically amplified resist having high transmittance of radiation, sensitivity, resolution, dry etching resistance, and pattern profile. |