| abstract |
A radiation-sensitive resin composition suitable as a chemically-amplified resist is provided. The composition comprised (A) a resin insoluble or scarcely soluble in alkali, but becoming alkali soluble by the action of an acid, and (B) a photoacid generator. The resin comprises a recurring unit of the following formula (I), n n n wherein R 1 is typically a hydrogen atom and the —C (R 5 ) 3 structure is a 2-methyl-2-tricyclodecanyl group, 2-ethyl-2-tricyclodecanyl group, 2-methyl-2-adamantyl group, 2-ethyl-2-adamantyl group, 1-methylcyclopentyl group, 1-ethylcyclopentyl group, 1-methylcyclohexyl group, or 1-ethylcyclohexyl group. |