| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-092 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 |
| filingDate |
2002-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2006-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f2b75c99fda4e28000da74a45b571a5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_694db723d5380c13294d67a1e2a7d434
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f4c53372172e3709a48ae111dd7ce1b |
| publicationDate |
2006-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7067226-B2 |
| titleOfInvention |
Photosensitive film for circuit formation and process for producing printed wiring board |
| abstract |
The photosensitive film for circuit formation of the present invention has: on a first film (base film), a photosensitive layer having a thickness of 0.1 to 10 μm; or a photosensitive layer having a thickness of 0.1 to 14 μm and containing a 2,2-bis(4-((meth)acryloxypolyalkoxy)phenyl)propane. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7309559-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010183845-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014178814-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004063025-A1 |
| priorityDate |
2001-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |