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publicationDate 2001-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-6312487-B1
titleOfInvention Polishing compound and an edge polishing method thereby
abstract A polishing compound in the form of a dispersion containing silicon oxide particles having an average diameter of 8 to 500 manometers and at least one kind of metal compound particles having an average diameter of 10 to 3000 nanometers and selected from metal oxides, metal nitrides and metal carbides. The concentration of silicon oxide particles is 1 to 15 wt. %. The concentration of silicon oxide particles is 0.1 to 10 wt. %. The pH of the dispersion is 8.3 to 11.5, and is buffered by the addition of a buffering combination composed of weak acid and/or weak base, wherein the logarithms of reciprocal number of acid dissociation constant at 25° C. of the weak acid and/or weak base is 8.0 to 12.5.
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