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filingDate 2000-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2001-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af58a4e48d9386bb9ec0c949a7ed1c7f
publicationDate 2001-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-6277762-B1
titleOfInvention Method for removing redeposited veils from etched platinum
abstract A method of etching a platinum electrode layer disposed on a substrate. The method comprises providing a substrate supporting a platinum electrode layer, an insulation layer on the platinum electrode layer, and a resist layer on the insulation layer. A portion of the insulation layer is etched by employing a plasma of an etchant gas to break through and to remove the portion of the insulation layer from the platinum electrode layer to expose part of the platinum electrode layer. The exposed part of the platinum electrode layer is then etched by employing a plasma of an etchant gas comprising argon. The etched platinum electrode layer is subsequently overetched by employing a high density plasma of an etchant gas to remove redeposited veils from the etched platinum electrode layer. The etched platinum electrode layer is employed in a semiconductor device.
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