| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-107 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0755
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0757 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-022 |
| filingDate |
1999-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2001-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50c05e1481593cf7a7f31bbf076799e4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_545ab069a1d0b17807b024864a9ba908
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea8cc1580a43a6322a8a1e75d47f63b8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3138fde95eafe03cf6c9a8cf3984f15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1512e632b2dd75442d3e4f65473c85eb |
| publicationDate |
2001-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6235436-B1 |
| titleOfInvention |
Semiconductor device using positive photosensitive resin composition and process for preparation thereof |
| abstract |
A positive type photosensitive resin composition which comprises (A) 100 parts by weight of a polyamide represented by the general formula (1):wherein X represents a tetravalent aromatic group; Y represents a divalent aromatic group; Z represents a divalent group represented by the formula:in which R1 and R2 represent divalent organic groups and R3 and R4 represent monovalent organic groups; a and b represent molar fractions; a+b=100 mole %; a=60.0-100.0 mole %; b=0-40.0 mole %; and n represents an integer of 2 to 500, (B) 1 to 100 parts by weight of a photosensitive diazoquinone compound and (C)1 to 50 parts by weight of a phenol compound represented by a specific structural formula and/or (D) 0.1 to 20 parts by weight of an organosilicon compound represented by a specific structural formula; and a semiconductor device in which a pattern of a polybenzoxazole resin obtained by using the above photosensitive resin composition is formed in a thickness of 0.1 to 20 mum on a semiconductor element. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005271980-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012100484-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7687208-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/SG-125127-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7371501-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009170026-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7678514-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7056641-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6613699-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007212899-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10203601-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009202794-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1375563-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004229167-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6939659-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10816900-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008305431-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004082756-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004229160-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7195849-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7244803-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8530119-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101495919-B |
| priorityDate |
1996-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |