abstract |
A conductive paste including an organic binder having an acidic functional group; an inorganic powder containing glass and/or ceramic; a conductive metallic powder; and a mono-ol compound having a boiling point of about 178 DEG C. or higher. At least one of the inorganic powder and the conductive metallic powder contains a multivalent metal. The paste is useful in the formation of a fine and minute thick-film conductive pattern having strong adhesion to a substrate. |