| abstract |
An analog capacitor is formed as part of an integrated circuit, using normal manufacturing methods, and then the upper electrode of this capacitor is used as part of the end point detection scheme during chem.-mech. polishing (CMP). Said upper electrode is formed from polysilicon and as soon as its upper surface is exposed as a result of the CMP, the presence of silicon particles in the removed material is readily detected by one of several possible methods. |