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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-40
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18
filingDate 1996-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1997-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2dda4c96af9bb92248633f6fc1c886ad
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06d0561d645124a56df815b67be585c5
publicationDate 1997-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-5631332-A
titleOfInvention Curing agents for epoxy resins comprising bis(aminomethyl)bicyclo[2.2.1]heptane adducts
abstract A curing agent for epoxy resins, prepared by reacting 2,5- and 2,6-bis(aminomethyl)-bicyclo[2.2.1]heptanes (1 equivalent of the active hydrogen in the amino group) with an epoxy resin (a reaction product of bisphenols or a novolak resin with epichlorohydrin; an epoxy equivalent of 150-300 g/eq.; two or more epoxy groups per molecule; bisphenol-A diglycidyl ether or bisphenol-F diglycidyl ether in particular)(0.025-0.50 equivalents of the epoxy group). The reaction temperature is 40 DEG -120 DEG C. The amount of the curing agent is within the range of 20-75 parts by weight relative to 100 parts by weight of an epoxy resin to be cured. The curing agent has a high curing rate at a room temperature, and the epoxy resins cured by it have a good appearance as well as excellent adhesion, water resistance, and chemical resistance. Therefore, the curing agent is suitable for paints, civil engineering and construction materials, adhesives, casting resins, laminates, etc.
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