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publicationDate 1994-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-5346558-A
titleOfInvention Solderable anisotropically conductive composition and method of using same
abstract A novel anisotropically conductive solder paste and a method of use thereof to join metallic parts in electronic manufacturing processes, in particular surface-mount electronic manufacturing processes. The solder paste is fluxless and reflowable for purposes of repair and achieves electrical anisotropy by soldering component leads to circuit board pads, while maintaining electrical insulation properties between adjacent joints.
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