abstract |
A conductive die attach composition containing no solvent and substantially no ionic impurities which comprises: (a) an epoxy resin system comprising (i) at least one low viscosity epoxy resin; and (ii) at least one epoxy resin hardener; (b) at least one unsaturated monomer which, when polymerized, is not capable of reacting with said epoxy resin system; (c) at least one free radical initiator for polymericing said unsaturated monomer; and (d) finely divided silver particles. |