| abstract |
There is provided a process for forming bumps wherein a plurality of fine bumps are uniformly formed with high productivity. In this process, a resin ( 13 ) comprising solder powder and a convection additive ( 12 ) is supplied onto a substrate ( 10 ) having a plurality of electrodes ( 11 ) thereon. And subsequently the substrate ( 10 ) is heated to a temperature that enables the solder powder to melt while keeping a flat plate ( 14 ) in contact with a surface of the supplied resin ( 13 ). During this heating step, the molten solder powder is allowed to self-assemble onto the electrodes ( 11 ) so that a plurality of solder balls resulting from the grown molten solder powder are concurrently formed on the electrodes ( 11 ) in self-alignment manner. Finally, by moving the flat plate ( 14 ) away from the surface of the supplied resin ( 13 ), followed by removing such resin ( 13 ), there is provided the substrate ( 10 ) wherein the bumps ( 16 ) are formed on the plurality of the electrodes. |