| abstract |
A multi-layer resist comprising (A) a layer of a Langmuir-Blodgett film, (B) a layer of at least one thin film and (C) a substrate, said layer (B) being placed between said layer, (A) and said substrate (C). The multi-layer resists of the invention are applicable to ultra fine processing on the order of submicron, half-micron or quarter-micron, and the number of defects can be remarkably decreased. |