| abstract |
This invention relates to the prevention of mechanical and electrical failures in structures that are heat-treated, and more particularly relates to the use of coating layers containing Co and P on corrosible materials such as Cu. The invention has significant utility in the protection of Cu current-carrying lines in electronic structures that comprise multi layers that are subjected to heat treatments that would normally adversely affect the Cu lines. The CoP coating layer also acts to prevent interdiffusion between Cu and contact metals, such as Au. |