Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-1291 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4846 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49866 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
filingDate |
1990-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
1991-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35a8e870bf90d6f69f573a3b7545734b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d80c00067dd9357474e721441aaed30f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2fb561539f9b79ecd759fcd8c8574b13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17a8889674c91044d451131e1a43c2b2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb65c91acecca91a4a479ea8c8371af4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_474abad8ae54bf57a2225405f0529cf0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3618dd95353b2bd6f5544d9fe14285b1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35084bf399a40be107f19d6e33ed04a7 |
publicationDate |
1991-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-5038195-A |
titleOfInvention |
Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate |
abstract |
The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5189363-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015001722-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5173369-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005126410-A1 |
priorityDate |
1990-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |