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publicationDate 1991-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-5038195-A
titleOfInvention Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate
abstract The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.
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