| abstract |
A thermoplastic adhesive composition that is particularly suitable for use as a hot melt adhesive is disclosed that comprises at least about 10% by weight of a polyether-based thermoplastic polyurethane and another component selected from the group consisting of: (A) a polyamide formed by the condensation of a compound of the formula YN<Z>NH where Z is selected from the group consisting of <IMAGE> where R is selected from the group consisting of hydrogen and alkyl groups having from 1 to 6 carbon atoms and R1 is a divalent aliphatic hydrocarbon group having at least 1 carbon atom, Y is selected from the group consisting of hydrogen, R'NH2 and R'OH where R' is a divalent alkylene radical having from 1 to 6 carbon atoms, with an amide forming derivative of a polymeric fat acid; (b) a thermoplastic copolyester made from the polyesterification reaction between terephthalic acid, cyclohexanedimethanol, a diol in addition to cyclohexanedimethanol and a dibasic acid in addition to terephthalic acid; or (C) a polyester-polyamide formed by heating a mixture of about 50 to about 99% by weight of component (A) with about 1 to about 50% by weight of component (B) at a temperature above the melting point of components (A) and (B) for a sufficient period to effect ester interchange. |