| abstract |
The inventive moisture-curing hot-melt adhesive composition provided in the form of granulated material, pellets or powder can be produced by: a.) melting the reactive hot-melt adhesive composition and heating the melt to temperatures ranging from 110 DEG C to 180 DEG C, preferably from 130 DEG C to 150 DEG C, while excluding moisture; b.) extruding this melt through nozzles having a diameter ranging from 0.5 mm to 30 mm, preferably from 2 mm to 10 mm, onto a cooled surface also while excluding moisture; c.) cooling the granulated material while excluding moisture whereby causing the composition to solidify; d.) removing the cooled hot-melt adhesive granulated material and, optionally, after-crystallizing the granulated material in a moving, temperature-controlled, liquid-tight receptacle such as, e.g. a fluidized bed, a vibrating trough or rotary drum, until the granular particles are compacted to such an extent that they no longer stick together in the following step; e.) filling liquid-tight packagings while excluding moisture. These reactive hot-melt adhesives can be poured, are free-flowing and can thus be used with all conventional application machines for hot-melt adhesives. As a result, the use of special vat melting devices and delivery pumps is no longer necessary. |