http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1454957-A4

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filingDate 2002-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2007-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1454957-A4
titleOfInvention THERMOPLASTIC RESIN COMPOSITION FOR INTEGRATED CIRCUIT BOARDS
abstract An IC card constituted of an IC substrate, a hot-melt resin layer and a skin in which the three are so strongly bonded with each another as to cause little delamination and which permits embossing. A resin composition comprising the following specific polyester and polyamide is used as the hot-melt resin. Polyester: a saturated copolyester comprising polyol units derived from cyclohexanedimethanol, and Polyamide: a copolyamide comprising polyamine units derived from a compound of the general formula (1): (1) wherein four Rs may be the same or different from each other and are each hydrogen or C1-4 alkyl; and Z is hydrogen or NH2R’ (wherein R’ is C1-4 alkylene).
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