http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017158913-A1

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publicationDate 2017-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2017158913-A1
titleOfInvention Chemical mechanical polishing (cmp) composition
abstract A chemical mechanical polishing (CMP) composition (Q) comprising (A) Colloidal or fumed inorganic particles (A) or a mixture thereof in a total amount of from 0.0001 to 2.5 wt.-% based on the total weight of the respective CMP composition (B) at least one amino acid in a total amount of from 0.2 to 1 wt.-% based on the total weight of the respective CMP composition (C) at least one corrosion inhibitor in a total amount of from 0.001 to 0.02 wt.-% based on the total weight of the respective CMP composition (D) hydrogen peroxide as oxidizing agent in a total amount of from 0.0001 to 2 wt.-% based on the total amount of the respective CMP composition (E) aqueous medium wherein the CMP composition (Q) has a pH in the range of from 6 to 9.5.
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