Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ba54db1bfe2fae432fc2791a738cba4d http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_76ba102ea9c02b6633d64bf09c5b89a4 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1436 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C30B33-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-04 |
filingDate |
2014-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75cf561f0ee79c182164e1a07a789050 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_874f1d9e8df67103c5753eb7b77e3c04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_061775b9401c28d9c639a8da5d3d5066 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81de5a86b6bcb244790307ee1c7bf8d8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ec15c3b2e411366394b0920a2470ae7 |
publicationDate |
2016-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2016060488-A1 |
titleOfInvention |
Polishing of hard substrates with soft-core composite particles |
abstract |
A chemical mechanical polishing (CMP) includes providing a slurry including composite particles dispersed in a water-based carrier that comprise a plurality of hard particles on an outer surface of a soft-core particle. The hard particles have a Mohs hardness at least 1 greater than a Mohs hardness of the soft core particle and/or a Vickers hardness at least 500 Kg/mm 2 greater than the soft-core particle. A substrate having a substrate surface with a hardness greater than a Mohs number of 6 or a Vickers hardness greater than 1,000 kg/mm 2 is placed into a CMP apparatus having a rotating polishing pad, and CMP is performed with the rotating polishing pad and the slurry to polish the substrate surface. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018340095-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023076100-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021155324-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9761454-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019367776-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11261346-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111558853-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016133466-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10946344-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11339309-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109251681-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10655035-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115175971-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110072956-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020527612-A |
priorityDate |
2014-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |