| abstract |
A semiconductor device that is suitable for miniaturization. A method for manufacturing a semiconductor device includes the steps of forming a semiconductor, forming a first conductor over the semiconductor, performing a second process on the first conductor so as to form a conductor according to a first pattern, forming a first insulator over the conductor having the first pattern, forming an opening in the first insulator, performing a third process on the conductor having the first pattern in the opening so as to form a first electrode and a second electrode and to expose the semiconductor, forming a second insulator over the first insulator, an inner wall of the opening, and an exposed portion of the semiconductor, forming a second conductor over the second insulator, and performing a fourth process on the second conductor so as to form a third electrode. |