| abstract |
A chemical mechanical polishing aqueous dispersion includes (A) abrasive grains, (B) an organic acid, and (C1) copper ions or (C2) at least one kind of metal atoms selected from Ta, Ti, and Rb, the chemical mechanical polishing aqueous dispersion including the copper ions (C1) at a concentration of 1×10 1 to 2×10 5 ppm, or including the at least one kind of metal atoms (C2) selected from Ta, Ti, and Rb at a concentration of 1×10 −1 to 1×10 3 ppm. |