| abstract |
To provide a cleaning solution for a substrate for a semiconductor device which is excellent in the ability to remove particles, organic contaminants, metal contaminants and composite contaminants of an organic matter and a metal attached on a substrate surface, whereby the substrate surface can be highly cleaned, without being corroded. Particularly, to provide a cleaning solution which is excellent in the ability to clean low dielectric constant (Low-k) materials on which liquid is easily repelled due to hydrophobic and of which the ability to remove particles is poor. n A cleaning solution for a substrate for a semiconductor device, which comprises the following components (A) and (B):n (A) an organic acid (B) a nonionic surfactant having an HLB value of from 5 to less than 13. |