| abstract |
A thin-film assembly ( 1 ) including a substrate ( 2 ) and at least one electronic thin-film component ( 8 ) applied on the substrate by thin-film technology, wherein a base electrode ( 4 ) is provided on the substrate, on which base electrode thin-film layers ( 21 ) forming part of the thin-film component are arranged together with an upper top electrode ( 9 ); the substrate ( 2 ) is comprised of a printed circuit board ( 2 ) known per se and including an insulation-material base body ( 3 ) and a metal coating as the conductor layer ( 5 ), wherein the conductor layer ( 5 ) forms the base electrode ( 4 ) and, to this end, is smoothed at least on the location of the thin-film component ( 8 ), and wherein a contact layer ( 18 ) is applied by thin-film technology between the smoothed, optionally reinforced, conductor layer ( 5 ) and the superimposed thin-film layers ( 21 ) of the thin-film component ( 8 ), which contact layer is physically or chemically adsorbed on the surface of the base electrode ( 4 ). |