| abstract |
A system and method for the fabrication of high reliability capacitors ( 1011 ), inductors ( 1012 ), and multi-layer interconnects ( 1013 ) (including resistors ( 1014 )) on various thin film hybrid substrate surfaces ( 0501 ) is disclosed. The disclosed method first employs a thin metal layer ( 0502 ) deposited and patterned on the substrate ( 0501 ). This thin patterned layer ( 0502 ) is used to provide both lower electrodes for capacitor structures ( 0603 ) and interconnects ( 0604 ) between upper electrode components. Next, a dielectric layer ( 0705 ) is deposited over the thin patterned layer ( 0502 ) and the dielectric layer ( 0705 ) is patterned to open contact holes ( 0806 ) to the thin patterned layer. The upper electrode layers ( 0907, 0908, 1009, 1010 ) are then deposited and patterned on top of the dielectric ( 0705 ). |