| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9beda2eda2cd9f012a3ebe9157f04d76 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31133
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02063
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76808 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 |
| filingDate |
2006-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03d0457ec15c18e51661368fb2186d6a |
| publicationDate |
2007-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2007037396-A1 |
| titleOfInvention |
Semiconductor processing using energized hydrogen gas and in combination with wet cleaning |
| abstract |
A method of fabricating a semiconductor device. The method comprises subjecting a substrate having formed thereon photoresist layer to a plasma hydrogen, the substrate further having formed thereon a sacrificial layer; contacting the photoresist layer with a photoresist removal solution; subjecting the sacrificial layer to a plasma hydrogen; and contacting the sacrificial material layer with an etchant solution. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010084086-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9613825-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9564344-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011139175-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006234475-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7811929-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9514954-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007049039-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8721797-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011143548-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7524738-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9373497-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8303755-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7994050-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7635649-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010311239-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9941108-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008268641-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7405161-B2 |
| priorityDate |
2004-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |