| abstract |
The present application refers to a method of patterning organic materials or organic/inorganic materials onto a substrate, comprising the following steps: (1) patterning of a water-soluble material “A” onto a surface of the substrate, thereby forming a substrate/material “A” surface; (2) depositing organic or organic/inorganic material “B” onto the substrate/material “A” surface; (3) lifting-off material “A” in aqueous solution; wherein, step (1) comprises the following steps: (1a) patterning of a photoresist material onto the substrate surface, thereby forming a substrate/photoresist material surface; (1b) depositing the water soluble material “A” onto the substrate/photoresist material surface; (1c) lifting-off the photoresist material in an organic solvent; or, alternatively, step (1) comprises the following steps: (1a′) depositing the water-soluble material “A” onto the substrate surface, thereby forming a substrate/material “A” surface; (1b′) patterning the photoresist material onto the substrate/material “A” surface; (1c′) etching the unmasked material “A” in aqueous solution; (1d′) lifting-off the photoresist material in an organic solvent. The present application also refers to the use of said method, to a pattern of organic materials or organic/inorganic materials prepared by said method, and to a substrate carrying such patterns. The application also refers to the use of a patterned nanoparticle film. |